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전자소재

LinkTron

Coverlay, 3Layer FPCB, Bonding Sheet, EMI Shield Film

LinkTron은 한화첨단소재의 FPCB용 소재 브랜드명입니다.

제품정보

  • 국내 범용 FPCB용
    소재 M/S
    No.1
  • 전자파 차폐 필름 제품군 Full Line-Up
    구축
  • 지속적인 신제품
    개발 투자

Coverlay, FCCL(Flexible Copper Clad Laminate), Bonding Sheet 는 절연 필름인 Polyimide film, 동박, 특수 접착제로 구성된 연성회로기판(FPCB, Flexible Printed Circuit Board)용 주요소재입니다.
연성회로기판은 일반적인 인쇄회로기판(PCB)인 Paper Phenol 또는 Glass Epoxy를 원재료로 사용하는 Rigid기판과 대응되는 개념으로 경박단소화, 고밀도화, 유연성, 굴곡성, 반복성이 요구되는 디지털 전자기기 등에 주로 사용됩니다.

어플리케이션

제품종류 및 구조

범용 제품군
(Mass Product Line Up)
  • 3층 FCCL

    Conventional

    PI Film > Adhesive > Copper Foil
  • Slim 3층 FCCL

    Can be used in Fabrication of FPC.
    cf) COG, COF

    PI Film > Adhesive > Copper Foil
  • Transparent FCCL

    Consists of Transparent Film, Adhesive and Copper Foil

    Transparent Film > Transparent Adhesive > Copper Foil
  • Coverlay, Slim Coverlay

    Can be used to Protection and Insulation Layer for FPCB and has Low Spring Back Properties

    PI Film > Adhesive > Release Paper
  • Black Coverlay

    Black PI type Coverlay
    Black Adhesive type Coverlay

    Release Paper > Black Adhesive > Release Paper
  • White Coverlay

    White type Coverlay for LED BLU Device.

    White Layer > PI Film > Adhesive > Release Paper
  • Anti Ion-migration Coverlay

    Excellent Insulation Resistance at High Temperature and
    Humidity. Raw Material for HDD, CD-ROM pick up and
    Fine Pattern.

    PI Film > Adhesive > Release Paper
  • Transparent Coverlay

    Consists of Transparent Film(PET, PEN, PI) and Adhesive.
    Can be used to Lighting for Advertising,
    Transparent Display and TSP etc.

    Transparent Film > Transparent Adhesive > Release Paper
  • Bonding Sheet(Anti Ion-migration)

    Can be used to make the Multi-Layer FPC.

    Release PET Film > Adhesive > Release Paper
  • PI Stiffener

    Can be used for Supporting and
    Protecting FPC Products.

    Thick PI Film > Adhesive > Release Paper
전자파 차폐 제품군
(EMI Product Line Up)
  • EMI Shielding Film, CNT-EMI Shielding Film

    Prevent Electromagnetic Interference Noise.
    Increase Transmitted Signal Speeds.
    Thin & Thick Type

    White Matt PET > Insulation Layer > Conductive Adhesive > Transparent Release Film
  • EMI Absorber Film

    Excellent EMI Absorbing Effects using the High Quality soft Magnetic Metal Powder.

    EMI Absorber Film - Magnetic Metal Powder
  • Conductive Double Sided Tape(CDT)

    Can be used for Supporting and Protecting FPC Products by Metal Stiffener and has Shielding Effects.

    Conductive Adhesive > White Release Film
고주파용 제품군
(High Frequency Product Line Up)
  • SCF(High Frequency FCCL)

    Consists of PI film and modified Cu. Low Initial Insertion
    Signal Loss.

    Copper Foil > Pi film > Copper Foil
  • High Frequency EMI

    High shielding performance in wide band range. Low Initial
    Insertion Signal Loss. High conductivity.

    White Matt PET > Insulation Layer > Copper Foil > Conductive Adhesive > Transparent Release Film
  • EMI-GND Expansion Film

    Increase Thermal Radiation & Grounding
    Good Contact Resistance & Inherent Superior Noise Suppression

    Protection Film > Metal : Aluminum > Metal : Copper > Conductive Adhesive > Release Film
  • 저유전 Bonding Sheet

    Impedance Control.
    Reduction of transmission loss.

    Release PET  Film > Adhesive > Release Paper
  • 저유전 Coverlay

    Impedance Control.
    Reduction of transmission loss.

    PI Film > Adhesive > Release Paper
자동차 전장용 제품군
(Automotive Product Line Up)
  • PEN / PET FCCL

    FCCL which consists of polyester film (e.g. PEN, PET film), Adhesive and copper

    PEN (or PET) Film > Transparent Adhesive > Copper Foil
  • PEN/PET Coverlay

    Insulation film which consists of polyester film (e.g. PEN or
    PET Film) and adhesive

    PEN, PET Film > Adhesive > Release Paper
  • High Tg Adhesive

    High-reliable adhesive for automative operating temperature (-40℃~125℃)

    Copper Foil > Pi film > Copper Foil

생산프로세스

Mixing > Coating > Laminating > Heating > Slitting > Final Products

사용 계통도

원자재
PI
SKCKOLON PI
동박
일진
LS엠트론
일본
PI
KANEKA
UBE
동박
NIKKO
MITSUI
FUKUDA
기타
PI
DUPONT(美)
TAIMIDE(臺)
동박
CFL(룩셈부르크)
FCCL
  • 한화첨단소재
  • 이녹스 첨단소재
  • 두산 전자
일본
  • ARISAWA
  • SHIN-ETSU
  • NIKKAN
  • Toyo
중국/대만
  • TAI-FLEX
  • MICROCOSM
  • FangBang
  • Thin-Flex
  • ROGERS
  • Dongyi
FPCB
  • 인터플렉스
  • 비에이치
  • 영풍전자
  • SI Flex
일본
  • MekTron
  • FUJIKURA
  • SUMITOMO
중국/대만
  • GLOBAL FLEX
  • CAREER
  • Unimicron
  • Multek
  • FOXCONN
MODULE
디스플레이
삼성 디스플레이
LG 디스플레이
멜파스
카메라
삼성전기
LG이노텍
캠시스
나무가
무선충전
아모텍
삼성전기
켐트로닉스
SET Marker
국내
  • 삼성전자
  • LG전자
유럽/북미
  • Apple
  • Google
  • MOTOROLA
  • Nokia
기타
  • Hauwei
  • Oppo/Vivo
  • BenQ
  • ZTE
  • TCL

기술정보

기술정보를 준비중입니다.

제품문의

LinkTron_국내
성명
장재훈
휴대전화
010.9702.6377
이메일
jjh05@hanwha.com
LinkTron_해외
성명
윤지호
휴대전화
010.2632.2394
이메일
yinzhihu@hanwha.com