전자소재
LinkTron
Coverlay, 3Layer FPCB, Bonding Sheet, EMI Shield Film
LinkTron은 
의 FPCB용 소재 브랜드명입니다.
제품정보
-
국내 범용 FPCB용
소재 M/S No.1 -
전자파 차폐 필름 제품군
Full Line-Up
구축 -
지속적인
신제품
개발 투자
Coverlay, FCCL(Flexible Copper Clad Laminate), Bonding Sheet 는 절연 필름인 Polyimide film, 동박, 특수 접착제로 구성된 연성회로기판(FPCB, Flexible Printed Circuit Board)용 주요소재입니다.
연성회로기판은 일반적인 인쇄회로기판(PCB)인 Paper Phenol 또는 Glass Epoxy를 원재료로 사용하는 Rigid기판과 대응되는 개념으로 경박단소화, 고밀도화, 유연성, 굴곡성, 반복성이 요구되는 디지털 전자기기 등에 주로 사용됩니다.
어플리케이션
제품종류 및 구조
범용 제품군
(Mass Product Line Up)
-
3층 FCCL
Conventional
-
Slim 3층 FCCL
Can be used in Fabrication of FPC.
cf) COG, COF
-
Transparent FCCL
Consists of Transparent Film, Adhesive and Copper Foil
-
Coverlay, Slim Coverlay
Can be used to Protection and Insulation Layer for FPCB and has Low Spring Back Properties
-
Black Coverlay
Black PI type Coverlay
Black Adhesive type Coverlay
-
White Coverlay
White type Coverlay for LED BLU Device.
-
Anti Ion-migration Coverlay
Excellent Insulation Resistance at High Temperature and
Humidity. Raw Material for HDD, CD-ROM pick up and
Fine Pattern.
-
Transparent Coverlay
Consists of Transparent Film(PET, PEN, PI) and Adhesive.
Can be used to Lighting for Advertising,
Transparent Display and TSP etc.
-
Bonding Sheet(Anti Ion-migration)
Can be used to make the Multi-Layer FPC.
-
PI Stiffener
Can be used for Supporting and
Protecting FPC Products.
전자파 차폐 제품군
(EMI Product Line Up)
-
EMI Shielding Film, CNT-EMI Shielding Film
Prevent Electromagnetic Interference Noise.
Increase Transmitted Signal Speeds.
Thin & Thick Type
-
EMI Absorber Film
Excellent EMI Absorbing Effects using the High Quality soft Magnetic Metal Powder.
-
Conductive Double Sided Tape(CDT)
Can be used for Supporting and Protecting FPC Products by Metal Stiffener and has Shielding Effects.
고주파용 제품군
(High Frequency Product Line Up)
-
SCF(High Frequency FCCL)
Consists of PI film and modified Cu. Low Initial Insertion
Signal Loss.
-
High Frequency EMI
High shielding performance in wide band range. Low Initial
Insertion Signal Loss. High conductivity.
-
EMI-GND Expansion Film
Increase Thermal Radiation & Grounding
Good Contact Resistance & Inherent Superior Noise Suppression
-
저유전 Bonding Sheet
Impedance Control.
Reduction of transmission loss.
-
저유전 Coverlay
Impedance Control.
Reduction of transmission loss.
자동차 전장용 제품군
(Automotive Product Line Up)
-
PEN / PET FCCL
FCCL which consists of polyester film (e.g. PEN, PET film), Adhesive and copper
-
PEN/PET Coverlay
Insulation film which consists of polyester film (e.g. PEN or
PET Film) and adhesive
-
High Tg Adhesive
High-reliable adhesive for automative operating temperature (-40℃~125℃)
생산프로세스
사용 계통도
원자재
- PI
- SKCKOLON PI
- 동박
- 일진
- LS엠트론
일본
- PI
- KANEKA
- UBE
- 동박
- NIKKO
- MITSUI
- FUKUDA
기타
- PI
- DUPONT(美)
- TAIMIDE(臺)
- 동박
- CFL(룩셈부르크)
FCCL
- 이녹스 첨단소재
- 두산 전자
일본
- ARISAWA
- SHIN-ETSU
- NIKKAN
- Toyo
중국/대만
- TAI-FLEX
- MICROCOSM
- FangBang
- Thin-Flex
- ROGERS
- Dongyi
FPCB
- 인터플렉스
- 비에이치
- 영풍전자
- SI Flex
일본
- MekTron
- FUJIKURA
- SUMITOMO
중국/대만
- GLOBAL FLEX
- CAREER
- Unimicron
- Multek
- FOXCONN
MODULE
- 디스플레이
- 삼성 디스플레이
- LG 디스플레이
- 멜파스
- 카메라
- 삼성전기
- LG이노텍
- 캠시스
- 나무가
- 무선충전
- 아모텍
- 삼성전기
- 켐트로닉스
SET Marker
국내
- 삼성전자
- LG전자
유럽/북미
- Apple
- MOTOROLA
- Nokia
기타
- Hauwei
- Oppo/Vivo
- BenQ
- ZTE
- TCL
기술정보
기술정보를 준비중입니다.