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电子材料

LinkTron

Coverlay, 3Layer FPCB, Bonding Sheet, EMI Shield Film

LinkTron是韩华思路信/高新材料所开发的用于FPCB的材料品牌名称。

产品资讯

  • 韩国通用FPCB材料M/S第一
  • 构建电磁波屏蔽膜产品群Full Line-Up
  • 坚持不懈投资新产品开发

Coverlay、 FCCL（Flexible Copper Clad Laminate、 Bonding Sheet是由聚酰亚胺膜（Polyimide film、铜箔、特殊粘合剂组成、用于柔性线路板（FPCB、Flexible Printed Circuit Board）的主要材料。

柔性线路板：有别于一般印制电路板（PCB）Paper Phenol与以Glass Epoxy为原料制成的Rigid基板、主要用于要求具有轻薄短小、高密度、柔软性、弯曲性、反复性等特性的数码电子设备等领域。

Application

LinkTron（3Layer FCCL&EMI） Application

种类与结构

Mass
Product Line Up EMI
Product Line Up High Frequency
Product Line Up Automotive
Product Line Up
  • 3Layer FCCL : Conventional
  • Slim 3Layer FCCL : Can be used in Fabrication of FPC. cf) COG, COF
  • Transparent FCCL : Consists of Transparent Film, Adhesive and Copper Foil
  • Coverlay, Slim Coverlay : Can be used to Protection and Insulation Layer for FPCB and has Low Spring Back Properties
  • Black Coverlay : Black PI type Coverlay Black Adhesive type Coverlay
  • White Coverlay : White type Coverlay for LED BLU Device.
  • Anti Ion-migration Coverlay : Excellent Insulation Resistance at High Temperature and Humidity. Raw Material for HDD, CD-ROM pick up and Fine Pattern.
  • Transparent Coverlay : Consists of Transparent Film(PET, PEN, PI) and Adhesive. Can be used to Lighting for Advertising, Transparent Display and TSP etc.
  • Bonding Sheet(Anti Ion-migration) : Can be used to make the Multi-Layer FPC.
  • PI Stiffener : Can be used for Supporting and Protecting FPC Products.
  • EMI Shielding Film, CNT-EMI Shielding Film : Prevent Electromagnetic Interference Noise. Increase Transmitted Signal Speeds. Thin & Thick Type
  • EMI Absorber Film : Excellent EMI Absorbing Effects using the High Quality soft Magnetic Metal Powder.
  • Conductive Double Sided Tape(CDT) : Can be used for Supporting and Protecting FPC Products by Metal Stiffener and has Shielding Effects.
  • SCF(High Frequency FCCL) : Consists of PI film and modified Cu. Low Initial Insertion Signal Loss.
  • High Frequency EMI : High shielding performance in wide band range. Low Initial Insertion Signal Loss. High conductivity.
  • EMI-GND Expansion Film : Increase Thermal Radiation & Grounding Good Contact Resistance & Inherent Superior Noise Suppression
  • Low DK Bonding Sheet : Impedance Control. Reduction of transmission loss.
  • Low DK Coverlay : Impedance Control. Reduction of transmission loss.
  • PEN / PET FCCL : FCCL which consists of polyester film (e.g. PEN, PET film), Adhesive and copper
  • PEN/PET Coverlay : Insulation film which consists of polyester film (e.g. PEN or PET Film) and adhesive
  • High Tg Adhesive : High-reliable adhesive for automative operating temperature (-40oC~125oC)

生产流程

生产流程
  1. Mixing
  2. Coating
  3. Laminating
  4. Heating
  5. Slitting
  6. Final Products

使用架构图

原材料
原材料
PISKCKOLON PI
原材料
Copper
FoilILJIN
LS Mtron
日本
PIKANEKA
UBE
日本
Copper
FoilNIKKO
MITSUI
FUKUDA
ETC
PIDUPONT（美）
TAIMIDE（臺）
기타
Copper
FoilCFL（Luxembourg）
FCCL
FCCL
Hanwha Solutions/Advanced Materials
INNOX Advanced Materials
Doosan Corporation Electro-Materials
日本
ARISAWA
NIKKAN
SHIN-ETSU
Toyo
中国/台湾
TAI-FLEX
Thin-Flex
MICROCOSM
ROGERS
FangBang
Dongyi
FPCB
韩国
Interflex
YP Electronics
BHflex
SI Flex
日本
MekTron
FUJIKURA
SUMITOMO
中国/台湾
GLOBAL FLEX
Multek
CAREER
FOXCONN
Unimicron
MODULE
Display
SAMSUNG Display
LG Display
MELFAS
Camera
SAMSUNG ELECTRO MECHANICS
CAMMSYS
LG Innotek
NAMUGA
Wireless
Recharge
Technology
AMOTECH
Hansol Technics
SAMSUNG ELECTRO MECHANICS
CHEMTRONICS
SET Marker
韩国
SAMSUNG ELECTRO MECHANICS
LG Electronics
欧洲 / 北美
Apple
MOTOROLA
Google
Nokia
中国/台湾
Hauwei
ZTE
Oppo/Vivo
TCL
BenQ

技术资讯

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